Das is a Researcher at PIXAPP. He is specialized in advanced electromagnetics and has industrial experience in electro-optic interfacing of photonic ICs. At Tyndall National Institute, he is leading the EU funded PhotonicLEAP project aimed at standardizing electro-optic packaging solutions at a high technology readiness level (TRL4-7). Developed technologies and processes are to be incorporated into the PIXAPP pilot-line.
In his previous role, Das was an R&D engineer at Intel (formerly Optoscribe Ltd) in Edinburgh, UK, developing PICs using Ultrafast Inscription Technology (ULI). He designed optical platforms that included micro-mirrors, waveguides, & mode converters in glass. Devices were geared for high density data center optical I/O and wafer level process development.
In 2019, Das completed his PhD from the GGIEMR group at the University of Nottingham (UoN), UK. He also completed his MSc in Photonics Engineering from UoN in 2014.
He finished his BSc in EEE in 2013, from Bangladesh University of Engineering & Technology (BUET).
