Parnika joined Tyndall National Institute as a PhD Researcher in 2020. Her research focusses on the co-design and co-packaging of photonic integrated circuits and electronic integrated circuits under the supervision of Prof. Peter O’Brien. Currently, she is working on the design of a thermally-stable high speed interposer for 2.5D integration of electronic and photonic chips. The aim for her research is to get a baseline around moving to scalable wafer level packaging in the photonics domain.
Parnika received her M.S degree from National Taiwan University of Science and Technology in 2019, where she worked on the silicon micro-mirror design for packaging active and passive chips.
Being an enthusiastic bookworm, her reading list includes works from James Joyce and Neil Gaiman.
