Saif Wakeel is currently pursuing a Ph.D. at Tyndall National Institute, University College Cork. His research interests include wafer level photonic packaging, interposers for photonic packaging, flip-chip packaging. His Ph.D. project is focused on designing, fabricating, testing and establishing design rules for wafer level photonic packaging by transfer printing the passive devices/components.
Tyndall National Institute is one of Europe’s leading research centers in electronic and photonic packaging technology, and the largest research facility of its type in Ireland. Quality of research facilities, advanced and futuristic research, and proficient supervision in the field of photonic packaging technology are the important factors that led me to become a part of this greatest institute and I believe this institute will fulfill my endeavors of becoming an expert in photonic packaging technology.
Saif Wakeel received the Bachelor degree (Hons.) in mechanical engineering from Aligarh Muslim University, Aligarh, India, in 2018, and the Master by research degree in engineering science from University of Malaya, Kuala Lumpur, Malaysia in 2021.
He was a Research and Development Intern at NXP Semiconductors, Malaysia, for two years. He has completed eight months Erasmus+ fellowship program at Dicle University, Diyarbakir, Turkey in 2020. He was a Research Intern at the National University of Singapore (NUS), Singapore in 2017.
